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Low-Pressure Molding (LPM) Resins

As the need for more sustainable and cost-effective options for encapsulating and protecting sensitive electronic components grows, hot melt polyamide resins for low-pressure molding (LPM) offer a viable solution.

Compared to other methods, such as potting, LPM increases production process efficiency and reduces the likelihood of errors, material usage, and weight, while allowing the final product to maintain the performance required for its intended use.

By choosing the right LPM encapsulation technology, you can achieve additional benefits.
Looking for the LPM technology that best suits your needs?

hot-melt resins

Pure, non-reactive, solvent-free copolyamide hot melt resin specially designed for l(...)

Thermelt 195

Pure, non-reactive, solvent-free copolyamide hot melt resin specially designed for l(...)

Thermelt 817

Pure, non-reactive, solvent-free copolyamide hot melt resin specially designed for l(...)

Thermelt 858

Pure, non-reactive, solvent-free copolyamide hot melt resin specially designed for l(...)

Thermelt 861

Pure, non-reactive, solvent-free copolyamide hot melt resin specially designed for l(...)

Thermelt 865

Pure, non-reactive, solvent-free copolyamide hot melt resin specially designed for l(...)

Thermelt 866

Pure, non-reactive, solvent-free copolyamide hot melt resin specially designed for l(...)

Thermelt 867

Pure, non-reactive, solvent-free copolyamide hot melt resin specially designed for l(...)

Thermelt 868

Pure, non-reactive, solvent-free copolyamide hot melt resin specially designed for l(...)

Thermelt 869

Pure, non-reactive, solvent-free copolyamide hot melt resin specially designed for l(...)

Thermelt 870

Pure, non-reactive, solvent-free copolyamide hot melt resin specially designed for l(...)

Thermelt 875

Pure, non-reactive, solvent-free copolyamide hot melt resin specially designed for l(...)

Thermelt 892

Pure, non-reactive, solvent-free copolyamide hot melt resin specially designed for l(...)

Thermelt PAR 1000

Pure, non-reactive, solvent-free copolyamide hot melt resin specially designed for l(...)

Thermelt PAR 1002